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3U OpenVPX™ Intel® Xeon® SBC with One Smart Function Module Slot

The 68INT5 is a 3U OpenVPX Intel® Xeon® Processor E-2276ME based embedded Single Board Computer with integrated output graphics/video & I/O expansion. Balancing high-performance with relatively low-power dissipation, the processor supports up to six processing cores operating at up to 2.8 GHz. One I/O expansion module slot is provided that can be fitted/configured with any one of the 100+ NAI smart I/O and communications function modules. Ideally suited for rugged Mil-Aero applications, the 68INT5 delivers off-the-shelf solutions that accelerate deployment of SWaP-optimized systems in air, land and sea applications.  The 68INT5 includes BSP and SSK support for CentOS, Linux®, and Microsoft Windows®. In addition, SSKs are supplied with source code and board-specific library I/O APIs to facilitate system integration.

  • COSA® Architecture
  • VPX / OpenVPX (ANSI / VITA 65)
  • Slot profile: SLT3-PAY-2F2U-14.2.3
  • Module profile: MOD3-PAY-2F2U-16.2.3-3
  • Up to 1 independent smart I/O function module supported (configured option)
  • PCIe or SATA III I/F to function slot (e.g. for additional Gig-E ports or on-board NVM storage)
  • Intel® Xeon® six-core E-2276ME up to 2.8* GHz and 12 MB Cache
  • 32 GB DDR4 SDRAM w/ ECC (max)
  • 64 GB SATA II NAND Flash (on board)
  • Intel® UHD Graphics P630
  • HDMI / DVI output with 4K support (at 60 Hz) and OpenGL & DirectX Support
  • Supports Intel® Trusted Execution Technology
  • Supports TPM / Secure Key / Intel® AES
  • Operating Systems Supported: CentOS / Linux, Microsoft® Windows®
  • Background Built-In-Test (BIT) continually checks and reports on the health of each channel
  • IPMC Support (configured option) VITA 46.11 Tier-2, basic, compatible
  • Operating temperature: 0° C to 70° C commercial, -40°C to +85°C rugged

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Accelerate Your Time-to-Mission™ With COSA®

NAI’s Configurable Open Systems Architecture™ (COSA®) offers a choice of over 70 smart I/O, communication, and Ethernet switch functions, providing the highest packaging density and greatest flexibility of any multifunction I/O board in the industry. Preexisting, fully-tested functions can be combined quickly and easily in an unlimited number of ways. Each I/O function has dedicated processing, unburdening the system Single Board Computer (SBC) from unnecessary data management overhead.

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