68ARM3

3U OpenVPX™ SOSA™-Aligned Single Board Computer NXP Layerscape® LX2 Processor Family (8, 12, or 16 Cortex-A72 Cores)

The 68ARM3 is a SOSA™-Aligned 3U OpenVPX single board computer built on the Xilinx Zynq® UltraScale+™ dual- or quad-core ARM® Cortex™-A53 MPCore™ SoC with 8GB DDR4 memory, that can be configured with up to two Smart I/O and communications function modules when fitted with the NAI-XMC configuration option to tailor analog/digital I/O and interface needs. Ideal for ruggedized systems, the 68ARM3 delivers off-the-shelf solution requiring high-bandwidth processing and low power consumption.

The 68ARM3 includes BSP and SSK support for Wind River® VxWorks® 7.x (including HVP), Xilinx® PetaLinux, and DDC-I Deos™. In addition, SSKs are supplied with source code and board-specific I/O API libraries to facilitate system integration.

Features

• OpenVPX (ANSI/VITA 65) SOSA™-Aligned Profiles Supported: SLT3-PAY-1F1F2U1TU1T1U1T-14.2.16; MOD3-PAY-1F1F2U1TU1T1U1T-16.2.15-1
• Processor/Memory: NXP LX2 Processor Family to 1.2 GHz w/ 8, 12, or 16 Cortex-A72 CPU Cores; (Up to) 8 GB DDR4 SDRAM Error correction code (ECC) memory; (Up to) 512 GB SATA SSD (256 GB default)
• Operating Systems: Wind River® Helix™ Virtualization Platform, Wind River® Linux, VxWorks®, VxWorks® Cert Edition, DDC-I Deos™, Green Hills INTEGRITY-178 tuMP
• IPMC Support: VITA 46.11 Tier-2, basic, compatible (configured option)
• COSA® Architecture (supports NAI XMC): Support for 2 independent smart I/O and communications modules; SATA II interface to function slot #2 (e.g. for 2 TB expansion option); Intelligent I/O library support
• Background Built-in-Test Continuous BIT (where applicable)
• Operating Temperature: Commercial: 0°C to +70°C; Rugged: -40°C to +71°C (Note: Maximum performance and temperature ranges are dependent on system environment, utilization, and thermal conditions; sustained operation of peak loads may not be supported - refer to documentation for specific guidelines.)
• Mechanical Options (ANSI/VITA 48): Air-cooled; 3U, 5HP/1.0” pitch; Conduction-cooled; 3U, 1.0” pitch