6U VME High Density I/O & Comm Board - 64E3

6U VME High Density I/O & Comm Board - 64E3

Model 6U VME 64E3

6U VME High Density I/O & Comm Board - 64E3

Five I/O and communication function module slots—
A variety of modules to choose from

NAI’s 64E3 is a 6U VME High-density I/O and Communication Board with five function module slots that can be configured with a variety of I/O, communication, and Ethernet functions. One of these module slots is standardized with a relatively large footprint and high-density channel count, enabling up to 48 channels of high functionality, feature-rich, programmable discrete on a single 6U board. Using multiple DSPs, the enhanced motherboard enables higher processing power and dedicated pre-processing control for each module.

By eliminating the need for multiple, specialized, single-function boards, this unique design increases packaging density, saves enclosure slots, and reduces power consumption. The 64E3, a low-power/high-performance board, is ideally suited for rugged defense, commercial aerospace, and industrial applications.

In a VME chassis, the 64E3 acquires sensor measurement data and controls simulation signals, and makes this information available to an external host processor via Gigabit Ethernet (Gig-E) or PCIe. Preexisting, fully-tested functions can be quickly and easily combined in an unlimited number of ways. Each I/O function has dedicated processing, unburdening the system Single Board Computer (SBC) from unnecessary data management overhead.

This product has been replaced by the 64G5. It is still supported on existing projects and installations. View our Obsolescence Policy for additional information. Please refer to our Multifunction I/O Boards page for a listing of current products.


  • 6U VME with Master VME Bus capability
  • Support for 5 independent, intelligent function modules
  • 4 standard footprint modules
  • 1 large footprint, 48 channel, high-density module
  • A variety of I/O, communication, and Ethernet modules to choose from
  • Control via either VME Bus or dual Gigabit Ethernet interfaces
  • Connections via front panel, rear panel, or both
  • Automatic Background Built-in-Test (BIT) (module dependent)
  • Software Support Kits (SSKs) and drivers available
  • Commercial and rugged models
  • Operating temperature: 0° C to 70° C commercial, or -40° C to +85° C rugged

Document DownloadsDate
64E3 Data Sheet
64RTE3 (Rear Transition Card) Data Sheet
64E3 Specifications
64E3 Operations Manual
Complete manual that includes all available function modules.
64E3 Operations Custom Manual
Abbreviated manual that includes only function modules selected in the part number.
E7 Module Users Guide Addendum
NAI Ethernet Interface for Embedded IO Boards Specification

Note: Linux Driver(s): All Linux driver / source code are provided as is without change support.
News ItemsDate
All Discretes are not Created Equal
No longer just the basic On/Off "workhorse," Discrete I/O interfaces are standing up to the rigors of modern control systems...
Board and Box Level Systems Face SWaP Design Challenges
Reducing size, weight and power of military systems remains a challenge, especially when shrinking budgets are putting pressure on costs.
Distributed I/O Data and Processing Architectures
Modern military platforms continue to place an ever greater reliance on electronics for their operation.
NAI 1Q 2011 Newsletter
NAI—First to Market—SBC w/ Multi-function I/O
NAI 3Q 2011 Newsletter
NAI Announces: New 3U CPCI/6U VME Layer 2+ Unmanaged, 12-Port, Gig-E Ethernet Switch/New Sensor Interface Unit(SIU3-5)/Input Power Line Conditioner with holdup capability