3U cPCI High Density I/O & Comm Board

3U cPCI High Density I/O & Comm Board

Model 3U cPCI 75D4

3U cPCI High Density I/O & Comm Board

One I/O and communication function module slot—
A variety of modules to choose from


NAI’s 75D4 is a 3U cPCI High-Density I/O and Communication Board with a single, high-density function module slot. In addition, the motherboard also includes an option for an integrated four-channel RS232/423/422/485 serial communication complement. This low-power/high-performance board is ideally suited for rugged defense, commercial aerospace, and industrial applications.

The module slot is standardized with a relatively large footprint and high-density channel count, enabling up to 48 channels of high functionality, feature-rich, programmable discrete on a single 3U board. It can be configured with any one of a variety of high-density I/O and communication functions. Each I/O function has dedicated processing, unburdening the system Single Board Computer (SBC) from unnecessary data management overhead.

The 75D4 includes Software Support Kits (SSKs) for multiple operating systems. In addition, SSKs are supplied with source code and board-specific library I/O APIs to facilitate system integration.


  • 3U cPCI board with PCI Bus Master capability
  • Support for one, high-density, function module with up to 48 I/O channels
  • A variety of high-density, I/O and communication modules to choose from
  • 4 integrated RS232/422/423/485 serial ports (optional)
  • Control via PCI Bus or dual Gigabit Ethernet (Gig-E) interfaces
  • Connections via front panel, rear panel, or both
  • Automatic Background Built-In-Test (BIT) (module dependent)
  • Software Support Kits (SSKs) and drivers available
  • Commercial and rugged models
  • Operating temperature: 0° C to 70° C commercial, -40° C to +85° C rugged

Document DownloadsDate
75D4 Data Sheet
75RTD4-ETH (Rear Transition Card) Data Sheet
75D4 Specifications
75D4 Operations Manual
Complete manual that includes all available function modules.
NAI Ethernet Interface for Embedded IO Boards Specification
News ItemsDate
Board and Box Level Systems Face SWaP Design Challenges
Reducing size, weight and power of military systems remains a challenge, especially when shrinking budgets are putting pressure on costs.
Distributed I/O Data and Processing Architectures
Modern military platforms continue to place an ever greater reliance on electronics for their operation.