Improved Data Modem (IDM OSA) - Airborne System
NAI’s complete solution for the IDM OSA was comprised of the following products:
- COTS 3u cPCI rugged, conduction-cooled SBC (75SBC4)
- Multifunction I/O serial interface and Gig-E layer 2+ switch boards ( 75C5, 75D4)
- High efficiency power supply (55MQ2)
- Power conditioning unit (44LS1)
- Four 3U cPCI boards
The 3U cPCI boards were configured with a variety of functions. The functions included:
- One 3U cPCI SBC - Freescale Quad Core P2041 QorIQ 1.2 GHz processor with MIL-STD-1553-to-Ethernet communications
- Four CNR communications with discrete I/O ports
- Four RS-232/422/485/423 programmable asynchronous serial communication ports
- Eight TTL/GPIO discrete channels
The Improved Data Modem (IDM) is the common solution for digitizing Army Aviation. It operates as an internet controller and gateway to the Tactical Internet and Fire Support Internet for Army aircraft. With interfaces supporting a six-channel transmit/receive terminal, the IDM provides radio connectivity to the ARC-201D/231, ARC-186, ARC-164, and the Blue Force Tracker's MT-2011 and AVX-06/203 Transceivers. IDM provides a flexible, software-driven, digital messaging system that is interoperable with existing Army and Joint forces battlefield operating systems. The IDM is currently utilized by the Apache (AH-64D), Kiowa (OH-58D), Chinook (CH-47F), and Black Hawk (UH-60M) Army helicopter platforms.
Strict IDM requirements for 4-hour cold soak, turn-on operation at -54° C, and 4-hour continuous operation at 71° C at 20,000 feet were met. Moreover, strict power consumption of less than 75W input power as well as specific flight and gunfire vibration profiles had to be achieved. Stringent embedded operational/environmental specifications were met using standard NAI 3u cPCI COTS products and production methods, such as BGA component underfill to support the extreme vibration levels. NAI utilized in-house SMT, underfill, conformal coat, 5D X-RAY, and Automated Optical Inspection (AOI) capability for all Printed Circuit-Card Assemblies.