6U VME High Density I/O & Comm Board - 64E3

Model 6U VME 64E3

6U VME High Density I/O & Comm Board - 64E3

Five I/O and communication function module slots—
A variety of modules to choose from

NAI’s 64E3 is a 6U VME High-density I/O and Communication Board with five function module slots that can be configured with a variety of I/O, communication, and Ethernet functions. One of these module slots is standardized with a relatively large footprint and high-density channel count, enabling up to 48 channels of high functionality, feature-rich, programmable discrete on a single 6U board. Using multiple DSPs, the enhanced motherboard enables higher processing power and dedicated pre-processing control for each module.

By eliminating the need for multiple, specialized, single-function boards, this unique design increases packaging density, saves enclosure slots, and reduces power consumption. The 64E3, a low-power/high-performance board, is ideally suited for rugged defense, industrial, and commercial applications.

In a VME chassis, the 64E3 acquires sensor measurement data and controls simulation signals, and makes this information available to an external host processor via Gigabit Ethernet (Gig-E) or PCIe. Pre-existing, fully-tested functions can be quickly and easily combined in an unlimited number of ways. Each I/O function has dedicated processing, unburdening the system Single Board Computer (SBC) from unnecessary data management overhead.

Features:

  • 6U VME with Master VME Bus capability
  • Support for 5 independent, intelligent function modules
  • 4 standard footprint modules
  • 1 large footprint, 48 channel, high-density module
  • A variety of I/O, communication, and Ethernet modules to choose from
  • Control via either VME Bus or dual Gigabit Ethernet interfaces
  • Connections via front panel, rear panel, or both
  • Automatic Background Built-in-Test (BIT) (module dependent)
  • Software Support Kits (SSKs) and drivers available
  • Commercial and rugged models
  • Operating temperature: 0° C to 70° C commercial, or -40° C to +85° C rugged

 
Document DownloadsDate
64E3 Data Sheet
07/13/2015
64RTE3 (Rear Transition Card) Data Sheet
05/24/2013
64E3 Specifications
01/30/2016
64E3 Operations Manual
Complete manual that includes all available function modules.
01/30/2016
64E3 Custom Operations Manual
Abbreviated manual that includes only function modules selected in the part number.
01/30/2016
1553 Module (Nx) Programmer's Reference Guide
12/03/2012
E7 Module Users Guide Addendum
11/30/2011
NAI Ethernet Interface for Embedded IO Boards Specification
04/10/2015

Note: Linux Driver(s): All Linux driver / source code are provided as is without change support.
News ItemsDate
All Discretes are not Created Equal
No longer just the basic On/Off "workhorse," Discrete I/O interfaces are standing up to the rigors of modern control systems...
11/11/2011
Board and Box Level Systems Face SWaP Design Challenges
Reducing size, weight and power of military systems remains a challenge, especially when shrinking budgets are putting pressure on costs.
02/28/2014
Distributed I/O Data and Processing Architectures
Modern military platforms continue to place an ever greater reliance on electronics for their operation.
09/14/2010
NAI 1Q 2011 Newsletter
NAI—First to Market—SBC w/ Multi-function I/O
04/07/2011
NAI 3Q 2011 Newsletter
NAI Announces: New 3U CPCI/6U VME Layer 2+ Unmanaged, 12-Port, Gig-E Ethernet Switch/New Sensor Interface Unit(SIU3-5)/Input Power Line Conditioner with holdup capability
10/13/2011